9 parts on the board

Mobile & Embedded

Managed NAND and multichip solutions: UFS 4.0 and 3.1 for flagship and mid-range mobile, eMMC 5.1 for cost-optimized and automotive designs, and uMCP/eMCP packages combining LPDDR and managed NAND in one footprint.

Parts
9
Series
3
Manufacturers
3
Interface families
3

Comparison

Compare mobile & embedded

Every part in this category, side by side. Catalog data only, as published by the manufacturer.

Mobile & Embedded: manufacturer, interface, form factor, capacities and status for each part
ProductManufacturerInterfaceForm factorCapacitiesStatus
SK hynix ZUFS 4.0SK hynixUFS 4.0UFS BGA256 GB, 512 GB, 1 TBMass Production
Samsung UFS 4.0SamsungUFS 4.0UFS BGA256 GB, 512 GB, 1 TBMass Production
Samsung UFS 3.1SamsungUFS 3.1UFS BGA128 GB, 256 GB, 512 GBMass Production
Samsung eMMC 5.1Samsunge.MMC 5.1153-ball FBGA8 GB, 16 GB, 32 GB, 64 GB, 128 GB, 256 GBMass Production
SK hynix eMMC 5.1SK hynixe.MMC 5.1153-ball FBGA16 GB, 32 GB, 64 GB, 128 GB, 256 GBMass Production
SK hynix uMCP (LPDDR5X + UFS)SK hynixLPDDR5X + UFS 3.1uMCP BGA8+128 GB, 12+256 GB, 16+512 GBMass Production
Samsung eMCP (LPDDR4X + eMMC)SamsungLPDDR4X + e.MMC 5.1eMCP BGA3+32 GB, 4+64 GB, 8+128 GBMass Production
ADATA UFS31A SeriesADATAUFS 3.1UFS BGA128 GB, 256 GB, 512 GBMass Production
ADATA EMMC51CADATAe.MMC 5.1e.MMC BGA16 GB, 32 GB, 64 GB, 128 GB, 256 GBMass Production

Mobile & Embedded

UFS, eMMC, and multichip packages for mobile, automotive, and IoT designs

SK hynix, Samsung, ADATA lines on one desk, quoted against the same 4-hour clock. Send a part number and the sourcing team works the franchise and open market in parallel.

Parts
9
Series
3
Manufacturers
3
Interface families
3

Sourcing mobile & embedded? The desk quotes in 4 hours