5 parts on the board
High Bandwidth Memory
TSV-stacked high bandwidth memory from SK hynix and Samsung, from HBM2E through 12-high HBM3E, supplying the per-package bandwidth required by AI training and HPC silicon.
- Parts
- 5
- Series
- 3
- Manufacturers
- 2
- Interface families
- 1
Comparison
Compare high bandwidth memory
Every part in this category, side by side. Catalog data only, as published by the manufacturer.
| Product | Manufacturer | Interface | Form factor | Capacities | Status |
|---|---|---|---|---|---|
| SK hynix HBM3E 12-Hi 36GB | SK hynix | HBM3E | HBM stack (2.5D) | 36 GB | Mass Production |
| SK hynix HBM3E 8-Hi 24GB | SK hynix | HBM3E | HBM stack (2.5D) | 24 GB | Mass Production |
| Samsung HBM3E Shinebolt | Samsung | HBM3E | HBM stack (2.5D) | 24 GB, 36 GB | Mass Production |
| SK hynix HBM3 24GB | SK hynix | HBM3 | HBM stack (2.5D) | 16 GB, 24 GB | Mass Production |
| Samsung HBM2E Flashbolt | Samsung | HBM2E | HBM stack (2.5D) | 16 GB | Mass Production |
High Bandwidth Memory
Stacked HBM for AI accelerators and high-performance computing
SK hynix, Samsung lines on one desk, quoted against the same 4-hour clock. Send a part number and the sourcing team works the franchise and open market in parallel.
- Parts
- 5
- Series
- 3
- Manufacturers
- 2
- Interface families
- 1
01 / High Bandwidth Memory
HBM3E
3 parts
Fifth-generation extended HBM at 9+ Gbps per pin, up to 36 GB per stack.
SK hynix HBM3E 12-Hi 36GB
- Interface
- HBM3E
- Form factor
- HBM stack (2.5D)
- Density
- 36 GB
SK hynix HBM3E 8-Hi 24GB
- Interface
- HBM3E
- Form factor
- HBM stack (2.5D)
- Density
- 24 GB
Samsung HBM3E Shinebolt
- Interface
- HBM3E
- Form factor
- HBM stack (2.5D)
- Density
- 24 GB, 36 GB
02 / High Bandwidth Memory
HBM3
1 part
6.4 Gbps HBM in volume production for shipping accelerator platforms.
03 / High Bandwidth Memory
HBM2E
1 part
Proven HBM generation for HPC, networking, and FPGA designs.
