eMMC
Samsung eMMC 5.1
Cost-optimized managed NAND for entry mobile, IoT, and automotive designs
- Manufacturer
- Samsung
- Interface
- e.MMC 5.1
- Form factor
- 153-ball FBGA
- Category
- Mobile & Embedded
- Series
- eMMC
- Status
- Mass Production
Image: samsung.com
e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
Capacities
Overview
What this part is for
eMMC 5.1 is the workhorse managed-NAND interface for entry smartphones, tablets, set-top boxes, smart TVs, and countless embedded designs. Samsung's parts run HS400 mode at up to 250 MB/s sequential read with capacities from 8 GB to 256 GB.
The integrated controller handles wear leveling, bad-block management, and ECC, letting host SoCs use simple MMC interfaces without NAND management burden. Automotive and industrial temperature grades extend the line into telematics, cluster, and factory applications.
Datasheet
Specifications
8 rows, factory-original data
| Interface | e.MMC 5.1, HS400 |
|---|---|
| Form Factor | 153-ball FBGA (11.5 x 13 mm) |
| Capacities | 8 GB to 256 GB |
| Sequential Read | Up to 250 MB/s |
| Sequential Write | Up to 125 MB/s |
| NAND Type | Samsung V-NAND TLC / MLC options |
| Features | Command queue, RPMB, secure erase |
| Temp Grades | Consumer, industrial, automotive |
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