eMMC

SK hynix eMMC 5.1

Second-source e.MMC 5.1 with industrial and automotive temperature grades

SK hynixMass ProductionIndustrial
Manufacturer
SK hynix
Interface
e.MMC 5.1
Form factor
153-ball FBGA
Category
Mobile & Embedded
Series
eMMC
Status
Mass Production
SK hynix eMMC 5.1, 153-ball FBGA
SK hynix · 153-ball FBGA

Image: skhynix.com

e.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.

Capacities

16 GB32 GB64 GB128 GB256 GB
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Overview

What this part is for

SK hynix's eMMC 5.1 line covers 16 GB to 256 GB capacities in the standard 153-ball FBGA, running HS400 at up to 250 MB/s reads. For hardware programs, it provides pin-compatible second-sourcing against other eMMC vendors, reducing single-supplier risk.

Industrial grades rated -40°C to 85°C and automotive-oriented screening serve gateways, HMI panels, medical devices, and vehicle telematics. Firmware supports power-loss protection for data-at-rest integrity in systems subject to abrupt power removal.

Datasheet

Specifications

8 rows, factory-original data

SK hynix eMMC 5.1 full specifications
Interfacee.MMC 5.1, HS400
Form Factor153-ball FBGA (11.5 x 13 mm)
Capacities16 GB to 256 GB
Sequential ReadUp to 250 MB/s
Sequential WriteUp to 120 MB/s
NAND TypeSK hynix 3D TLC
FeaturesPower-loss protection, RPMB
Temp Grades-25°C to 85°C; industrial -40°C to 85°C

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