MCP
SK hynix uMCP (LPDDR5X + UFS)
LPDDR5X DRAM and UFS storage combined in a single mobile package
- Manufacturer
- SK hynix
- Interface
- LPDDR5X + UFS 3.1
- Form factor
- uMCP BGA
- Category
- Mobile & Embedded
- Series
- MCP
- Status
- Mass Production
Image: skhynix.com
UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
Capacities
Overview
What this part is for
The uMCP stacks LPDDR5X DRAM and UFS managed NAND in one package, cutting board footprint and simplifying routing for mid-range and slim smartphone designs. Combinations pair 8 to 16 GB of LPDDR5X with 128 to 512 GB of UFS 3.1 storage.
Single-package sourcing also consolidates procurement and qualification: one part number covers the memory subsystem. SK hynix supplies uMCP across consumer temperature grades with power characteristics tuned for battery-first duty cycles.
Datasheet
Specifications
7 rows, factory-original data
| Interface | LPDDR5X + UFS 3.1 |
|---|---|
| Form Factor | uMCP BGA |
| DRAM | 8 GB / 12 GB / 16 GB LPDDR5X |
| Storage | 128 GB / 256 GB / 512 GB UFS |
| DRAM Data Rate | Up to 8533 Mbps/pin |
| Storage Read | Up to 2,100 MB/s |
| Operating Temp | -25°C to 85°C |
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