MCP
Samsung eMCP (LPDDR4X + eMMC)
LPDDR4X and eMMC in one package for entry mobile and IoT devices
- Manufacturer
- Samsung
- Interface
- LPDDR4X + e.MMC 5.1
- Form factor
- eMCP BGA
- Category
- Mobile & Embedded
- Series
- MCP
- Status
- Mass Production
Image: samsung.com
eMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.
Capacities
Overview
What this part is for
The eMCP combines LPDDR4X DRAM with eMMC 5.1 managed NAND in a single BGA, the standard memory solution for entry smartphones, feature-rich wearables, and connected consumer devices. Typical configurations pair 3 to 8 GB of DRAM with 32 to 128 GB of storage.
One-package integration reduces board area, layer count, and assembly cost — decisive factors at entry price points. Samsung's vertical NAND and DRAM supply supports stable volume availability across long consumer product cycles.
Datasheet
Specifications
7 rows, factory-original data
| Interface | LPDDR4X + e.MMC 5.1 |
|---|---|
| Form Factor | eMCP BGA (11.5 x 13 mm) |
| DRAM | 3 GB / 4 GB / 6 GB / 8 GB LPDDR4X |
| Storage | 32 GB / 64 GB / 128 GB eMMC |
| DRAM Data Rate | Up to 4266 Mbps/pin |
| Storage Read | Up to 250 MB/s |
| Operating Temp | -25°C to 85°C |
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