HBM2E
Samsung HBM2E Flashbolt
16 GB HBM2E for HPC, FPGA, and networking silicon still in production
- Manufacturer
- Samsung
- Interface
- HBM2E
- Form factor
- HBM stack (2.5D)
- Category
- High Bandwidth Memory
- Series
- HBM2E
- Status
- Mass Production
Image: samsung.com
Flashbolt HBM2E at 3.6 Gbps per pin and 16 GB per stack, serving HPC, FPGA, and networking designs in sustained production.
Capacities
Overview
What this part is for
Flashbolt HBM2E delivers 16 GB per 8-high stack at 3.6 Gbps per pin — about 460 GB/s of bandwidth. While AI training has moved to HBM3-class memory, HBM2E remains designed into FPGAs, network switches, and HPC processors with long production schedules.
For those installed programs, continued HBM2E supply is a lifecycle requirement rather than a performance choice. Samsung maintains production and qualification support, making Flashbolt the practical sourcing route for mid-life HBM2E platforms.
Datasheet
Specifications
7 rows, factory-original data
| Interface | HBM2E, 1024-bit |
|---|---|
| Stack Height | 8-high |
| Capacity | 16 GB per stack |
| Data Rate | 3.6 Gbps/pin |
| Bandwidth | ~460 GB/s per stack |
| Packaging | TC-NCF, TSV |
| Target | FPGA, networking, HPC |
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