DDR4

Samsung DDR4 8Gb Component

Long-availability 8 Gb DDR4 die for embedded and networking programs

SamsungMass ProductionLong Lifecycle
Manufacturer
Samsung
Interface
DDR4
Form factor
FBGA component
Category
DRAM Components
Series
DDR4
Status
Mass Production
Samsung DDR4 8Gb Component, FBGA component
Samsung · FBGA component

Image: samsung.com

8 Gb DDR4-3200 component with extended availability for networking, industrial, and consumer designs.

Capacities

8 Gb
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Overview

What this part is for

The 8 Gb DDR4 component remains the volume memory of embedded computing: set-top boxes, routers, printers, industrial controllers, and automotive infotainment all continue to design in DDR4. Samsung supplies the die in x8 and x16 organizations at speed bins to 3200 MT/s.

Extended production commitments matter more than peak speed in these programs, and DDR4's mature ecosystem keeps board cost and validation effort low. Industrial temperature options support -40°C to 95°C operation for outdoor and automotive-adjacent applications.

Datasheet

Specifications

7 rows, factory-original data

Samsung DDR4 8Gb Component full specifications
InterfaceDDR4
Density8 Gb
Organizationx8, x16
Data Rate2666–3200 MT/s
Voltage1.2 V
PackageFBGA
Operating Temp0°C to 95°C (industrial: -40°C to 95°C)

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